2021


 

  1.  

  2. Z. Rao, Y. Lu, Z. Li, K. Sim, Z. Ma, J. Xiao, and C. Yu, “Curvy, shape adaptive imager based on conformal additive stamp printed ultrathin optoelectronic pixels with kirigami designs,” Nature Electronics, in press. 

  3. I.-K. Lee, A. L. Ludwig, M. J. Phillips, J. Lee, R. Xie, S. Gong, D. M. Gamm, and Z. Ma, “Ultrathin micromolded 3D scaffolds for high-density photoreceptor layer reconstruction,” Science Advances, 7, eabf0344 (2021). DOI: 10.1126/sciadv.abf0344

  4. H. Li, H. Zhang, S. Min, T. Zhou, S. Gong, X. Feng, and Z. Ma, “Hybrid liquid-metal heat dissipation structure enabled by phase transition for flexible electronics,” Semiconductor Science and Technology, 36, 055007 (2021). DOI: 10.1088/1361-6641/abed8c

  5. Y. Lan, H. Zhang, S. Min, D. Kim, S. Gong, Y. Xu, and Z. Ma, “S- to X-Band stretchable inductors and filters for soft and epidermal wireless applications,” ACS Applied Materials and Interfaces, DOI: 10.1021/acsami.0c22003

  6. M. Zhou, H. Song, X. Xu, A. Shahsafi, Y. Qu, Z. Xia, Z. Ma, M. Kats, J. Zhu, B. S. Ooi, Q. Gan and Z. Yu, “Vapor condensation with daytime radiative cooling,” Proceedings of the National Academy of Sciences, 118, e2019292118 (2021). DOI: 10.1073/pnas.2019292118

  7. Z. Fang, H. Zhang, S. Qiu, Y. Kuang, J. Zhou, Y. Lan, C. Sun, G. Li, and Z. Ma, “Versatile wood cellulose for biodegradable electronics,” Advanced Materials Technology, 2000928 (2021). DOI: 10.1002/admt.202000928